TSMC Advanced Node & Packaging Ramp

2nm ramp at 20k wpm targeting 100k by end-2026; A16 on track for H2 2026; CoWoS yield >98%, capacity doubling annually; SoIC capacity target 50k wpm by end-2027; packaging bottleneck persists with competitors absorbing overflow. Taiwan launched materials alliance for 2nm and advanced packaging, with ASE T-glass example highlighting materials substitution. AMD's $10B investment in EFB packaging with TSMC confirms capacity tightness and long-term demand. Foundry prices jumping 15% with Gartner's inference paradox (fivefold cost increase by 2028) explains sustained demand. Xiaomi's Xring O3 on TSMC 3nm adds a new customer win for advanced node. COUPE silicon photonics deep dive confirms Nvidia's Spectrum-X adoption and TSMC's platform approach, reinforcing COUPE as a key growth vector beyond CoWoS.