Competitive Threats: Intel EMIB, Samsung Foundry, and Anthropic Turnkey

Intel's EMIB packaging wins Google TPU business; TSMC has 'EMIB-like' program. Samsung's unverified 2.4M-wafer expansion claim and Tesla's in-house chip efforts add pressure. Counterpoint report adds Samsung's turnkey threat with Anthropic. New: Samsung Foundry delays 1.4nm process to 2029, while TSMC's A16 is on track for H2 2026, widening TSMC's process leadership and validating its node roadmap.