Dalio Macro Monitor

AI-related corporate debt overhang — issuance, covenants, CLO/NBFI spillovers

AI-related corporate debt overhang — issuance, covenants, CLO/NBFI spillovers

Key Questions

What is the scale of Big Tech's capex and high-yield issuance related to AI?

Big Tech companies have announced $630B in capex, accompanied by $330B in tech high-yield issuance. BofA forecasts HY spreads widening to 335bp by 2026.

How much AI-related bond issuance is expected from hyperscalers in 2025 and 2026?

Hyperscalers are projected to issue $121B in bonds in 2025, with 30-50% growth anticipated in 2026. This raises concerns about spread widening and duration implications for the market.

What market risks arise from AI-driven corporate debt overhang?

Increased issuance could pressure spreads and test investor appetite for long-dated tech debt. Spillovers to CLOs and non-bank financial institutions are also being monitored.

Big Tech $630B capex, $330B tech HY issuance; BofA forecasts 335bp HY spreads by 2026. AI Bond Issuance piece confirms $121B hyperscaler issuance in 2025, 30-50% growth in 2026, with spread widening and duration implications.

Sources (2)
Updated May 30, 2026