Metrology advances: wavelet‑GP monitoring and in‑line wafer/optics metrology (Wooptix)
Key Questions
What are the primary metrology advances highlighted here?
The highlight features wavelet-Gaussian Process (wavelet-GP) for multi-scale monitoring and Wooptix for in-line wafer and optics metrology. New techniques include High-Resolution Surface Normal Maps for slope/curvature on polished mirrors, Brewster's angle polarized light, AFM-optical synergy, FCS-VMamba AI defect recognition, and Speckle-based curvature optical metrology (SCOM).
How do these metrology tools support silicon post-polish control?
These techniques integrate for comprehensive Si post-polish control, measuring PSD, RMS, defects, and curvature in a closed-loop system within STP/hybrids. They enable full-spatial error control on curved mirrors. Bruker thin film tools loosely align with these capabilities.
What is Speckle-based curvature optical metrology (SCOM)?
SCOM is an advanced optical metrology method for 2D curvature and PSD measurements on curved mirrors, including full-spatial error control. It supports high-performance X-ray mirror quality standards and integrates into post-polish workflows.
Wavelet + Gaussian Process для мультискейл‑мониторинга; Wooptix для in-line. Новое: High-Resolution Surface Normal Maps (ex-9f45a649) для slope/curvature на polished mirrors; Brewster's angle polarized light (ex-2e69871c); AFM-optical synergy (ex-849b7980); FCS-VMamba AI defect recognition (ex-6bce3149); Speckle-based curvature optical metrology (SCOM, ex-1AHN0tvs) для 2D curvature/PSD на curved mirrors + full-spatial error control (ex-033668b9) интегрируются для Si post-polish control (PSD/RMS/defects/curvature, closed-loop в STP/hybrids). Bruker thin film tools loosely align.