Next-gen CMP, plasma, and coatings for ultra-smooth surfaces

This cluster explores how chemical mechanical polishing, plasma-assisted techniques, and atom-selective etching are being engineered to achieve near-atomic smoothness on materials like silicon, diamond, and β-Ga. The posts cover interfacial regulation strategies, sheet-by-sheet removal mechanisms, and molecular dynamics insights into material removal and microstructure evolution during polishing. They also highlight industrial advances such as superflat PVD-coated silicon for optics and semiconductor-grade wafer finishing, showing how better-controlled, faster polishing directly supports cutting-edge electronics, satellite optics, and high-energy laser systems.