AI Chip Supply Chain Capacity Race Intensifies
Key Questions
What partnership did NVIDIA announce with Amkor?
NVIDIA committed $1.5B in prepayments to Amkor for U.S. chip packaging and testing. This supports supply chain diversification away from TSMC.
What is the scope of Samsung's MOU with Broadcom?
The $200B agreement covers HBM4/4E, 2nm foundry, and advanced packaging through 2030. HBM remains sold out through 2027 amid strong demand.
How is Intel expanding its AI infrastructure plans?
Intel is raising capex to $20B and reaffirming its 14A roadmap after Q2 earnings beat estimates. The market is seeking more foundry customers to support growth.
What did AMD showcase at its Advancing AI 2026 event?
AMD highlighted Helios in production, EPYC Venice on 2nm, and inference now comprising 60% of the AI accelerator market. The shift from training to inference is accelerating.
Which companies are seeing strong gains in the AI supply chain?
Micron reported record revenue while SanDisk rose 574% YTD. Broader diversification efforts are underway as HBM capacity remains constrained.
NVIDIA commits $1.5B prepayment to Amkor for US packaging; Samsung signs $200B MOU with Broadcom covering HBM4/4E, 2nm foundry, and advanced packaging through 2030. HBM sold out through 2027, Micron record revenue, SanDisk up 574% YTD. Supply chain diversification away from TSMC accelerates. Intel Q2 beat but market wants foundry customer; Intel now raising capex to $20B and reaffirming 14A roadmap. AMD's Advancing AI event shows Helios in production, EPYC Venice on 2nm, and inference now 60% of AI accelerator market—shift from training to inference accelerating.