Advanced packaging/OSAT equipment tightness & ASML push
Key Questions
Why is advanced packaging capacity tight in the AI chip market?
TSMC's CoWoS at 2700mm² is strained by Nvidia locking up capacity, starving AI demand. US buildout lags behind, creating bottlenecks mostly in Asia.
What is Intel's EMIB-T technology and its rollout plans?
Intel's EMIB-T packaging is set for fab rollout in 2026, targeting hyperscalers like Google and Amazon for advanced AI accelerator designs. It addresses TSMC CoWoS capacity limits.
How are TSMC's suppliers creating a moat against rivals?
TSMC's suppliers like Gudeng, ASE, and Unimicron form a strong ecosystem, pulling rivals as global chipmakers seek to join the certified supply chain. Rivals target these Taiwanese suppliers to replicate TSMC's dominance.
What advancements are occurring in silicon photonics?
TSMC targets 2026 COUPE production for silicon photonics, while Samsung aims for 2029 CPO turnkey solutions. This intensifies the race amid AI-driven demand.
What investments is ASE making in capacity?
ASE plans to invest over $3.1B in a new fab and is doubling capacity. Tokyo Electron is committing ¥1.5T over five years to R&D in advanced packaging.
How is Nvidia influencing advanced packaging availability?
Nvidia has locked up a dominant share of the world's most advanced chip packaging capacity, exacerbating shortages as US buildout lags AI demand.
What role does TSMC play in US advanced packaging expansion?
TSMC is scrambling to bring advanced packaging to the US amid soaring AI demand, with its Arizona venture posting first profits and plans for six wafer fabs.
Why are global chipmakers targeting TSMC's supply chain?
TSMC's supplier moat spooks rivals, prompting them to join its certified supply chain for advanced packaging amid explosive AI data center growth.
TSMC CoWoS 2700mm²/Nvidia locks strains starving AI; Intel EMIB-T rollout 2026 hyperscalers; supplier moat (Gudeng/ASE/Unimicron) pulls rivals; SiPh COUPE 2026; ASE doubling/TEL ¥1.5T R&D; US buildout lags. Watch: capex, quals.