Advanced packaging/OSAT equipment tightness & ASML push
Key Questions
How is Intel's EMIB competing in advanced packaging?
Intel's EMIB is gaining AI customer commitments against TSMC's CoWoS. It positions Intel strongly in the advanced packaging race.
What expansion is planned for OSAT advanced packaging in 2026?
OSAT advanced packaging capacity is set for 2026, with ASE doubling its output. This addresses tightening equipment supply.
What capex is TSMC Arizona investing in packaging?
TSMC Arizona and JCET (精材) plan NT$10 billion capex for WLCSP and TSV. This brings advanced packaging to the US amid AI demand.
What is Tokyo Electron's R&D commitment?
Tokyo Electron is investing ¥1.5 trillion over five years in advanced packaging and HBM. This targets key bottlenecks in the supply chain.
What are the market projections for hybrid bonding?
Hybrid bonding market is expected to grow from $1.45 billion in 2025 to $2.75 billion by 2034. Demand is driven by AI and high-performance computing.
Why is advanced packaging a bottleneck?
Advanced packaging faces equipment tightness, with most capacity in Asia. US expansions like TSMC Arizona aim to alleviate AI-driven shortages.
What is TSMC's progress in silicon photonics?
TSMC targets 2026 production for COUPE in silicon photonics. Samsung aims for 2029 CPO turnkey solutions.
Who are Intel's potential AI packaging customers?
Intel is in talks with Google and Amazon for new packaging tech to power AI chips. This leverages EMIB for high-density integration.
Intel EMIB gaining AI customer commitments vs TSMC CoWoS; OSAT adv pkg 2026 (ASE doubling); TSMC Arizona/精材 NT$10B capex WLCSP/TSV; TEL ¥1.5T R&D adv pkg/HBM; hybrid-bond $1.45B'25-$2.75B'34. Watch: capex, queues.