PCB Design Rules for Thin/Heavy Copper
Key Questions
What are the key PCB design guidelines for thin wearables and heavy copper applications?
The highlight covers guidelines for thin wearables, heavy copper thermals, and RE probes. It also discusses CERN's open-source 17k KiCad library and new 3D printing fabrication methods using thick traces and copper tape.
What practical techniques are featured for SMD assembly and prototyping?
A new reflow technique using a pizza oven for SMD assembly is highlighted, along with 3D printing for quick prototypes. Altium training for processor interface schematics is also noted.
How does the transparent LED display project demonstrate advanced PCB techniques?
The project uses flex PCB and no-ground-plane routing in a transparent LED display. It is based on the related YouTube video showing custom matrix design to avoid standard opaque limitations.
Guidelines for thin wearables, heavy copper thermals, RE probes. CERN's open-source 17k KiCad library and Open Hardware Summit advance collaborative OSHW and PCB tools. New 3D printing fabrication using thick KiCad traces and copper tape for quick prototypes. New practical reflow technique using pizza oven for SMD assembly; Altium training for processor interface schematics. Latest: Transparent LED display project using flex PCB and no-ground-plane routing demonstrates advanced PCB design techniques.