OEM Verticalization, Chip Self-Reliance & Automation

KUKA AMP goes live at Toledo (Physical AI in body-in-white). Kyushu 7.1 earthquake halts Toyota, Honda, Renesas, TSMC – near-term disruption. Renesas to phase out Takasaki 6-inch fab, restructures for auto/data center. AI in manufacturing bottleneck: disconnected long-tail suppliers hinder ROI. L&T invests Rs5,000 crore in auto electronics. Siemens Cre8Ventures bridges physical-to-digital twins.