Applied Materials & SK hynix EPIC Center to accelerate AI memory R&D
Key Questions
What is the EPIC Center developed by Applied Materials and SK hynix?
The EPIC Center is a $5 billion facility set to open in March 2026, focused on accelerating AI DRAM and HBM R&D through materials stacks, device-package co-optimization, and hybrid-bonding technologies. It supports SK hynix's 30T won capex and Yongin fab HBM4E ramps to reclaim HBM leadership from Micron and Samsung.
What key investments are tied to SK hynix's HBM advancements?
SK hynix has committed $7.97B to ASML EUV systems through 2027, alongside new collaborations like Applied Materials-Micron on 6F² DRAM. Additional efforts include High-NA EUV for sub-5μm advanced packaging and Tokyo Electron's ¥1.5T R&D push on HBM Synapse amid ABF/CoWoS/He shortages.
What are the main checkpoints for the EPIC Center project?
Key checkpoints include tooling readiness, HBM4E yields, and design-technology co-optimization (DTCO). Challenges involve shortages in ABF, CoWoS, and helium, with TSMC's High-NA/CoWoS expansions exceeding $10B.
Applied Materials and SK hynix $5B EPIC Center (Mar 2026) targets AI DRAM/HBM with materials stacks, device-package co-opt, hybrid-bonding (BESI surge/AMAT stake); SK hynix 30T won capex/Yongin fab HBM4E ramps + Samsung/SK hybrid bonding push to retake HBM lead vs Micron/Samsung Nvidia shipments. SK hynix $7.97B ASML EUV thru 2027; new AMAT-Micron collab on 6F²; High-NA EUV for sub-5μm adv pkg + TEL ¥1.5T R&D HBM Synapse. High-NA/TSMC CoWoS $10B+ aids amid ABF/CoWoS/He shortages/LINTEC thinning. Checkpoints: tooling, HBM4E/yields, DTCO.